Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC). These include:
§ Two-terminal packages
§ Rectangular passive components (mostly resistors and capacitors):
§ 01005 (0402 metric) : 0.016" × 0.008" (0.4 mm × 0.2 mm)
§ 0201 (0603 metric) : 0.024" × 0.012" (0.6 mm × 0.3 mm)
§ 0402 (1005 metric) : 0.04" × 0.02" (1.0 mm × 0.5 mm)
§ 0603 (1608 metric) : 0.063" × 0.031" (1.6 mm × 0.8 mm)
§ 0805 (2012 metric) : 0.08" × 0.05" (2.0 mm × 1.25 mm)
§ 1206 (3216 metric) : 0.126" × 0.063" (3.2 mm × 1.6 mm)
§ 1210 (3225 metric) : 0.126" × 0.1" (3.2 mm × 2.5 mm)
§ 1806 (4516 metric) : 0.177" × 0.063" (4.5 mm × 1.6 mm)
§ 1812 (4532 metric) : 0.18" × 0.12" (4.5 mm × 3.2 mm)
§ 2010 (5025 metric) : 0.2" × 0.1" (5.0 mm × 2.5 mm)
§ 2512 (6332 metric) : 0.25" × 0.12" (6.35 mm × 3.0 mm)
Tantalum capacitors
§ EIA 3216-12 :3.2 mm × 1.6 mm × 1.2 mm
§ EIA 3216-18: 3.2 mm × 1.6 mm × 1.8 mm
§ EIA 3528-12: 3.5 mm × 2.8 mm × 1.2 mm
§ EIA 3528-: 3.5 mm × 2.8 mm × 2.1 mm
§ EIA 6032-15: 6.0 mm × 3.2 mm × 1.5 mm
§ EIA 6032-28: 6.0 mm × 3.2 mm × 2.8 mm
§ EIA 7260-38: 7.2 mm × 6.0 mm × 3.8 mm
§ EIA 7343-20: 7.3 mm × 4.3 mm × 2.0 mm
§ EIA 7343-31: 7.3 mm × 4.3 mm × 3.1 mm
§ EIA 7343-43: 7.3 mm × 4.3 mm × 4.3 mm
§ SOD: Small Outline Diode
§ SOD-523: 1.25 × 0.85 × 0.65 mm [3]
§ SOD-323: 1.7 × 1.25 × 0.95 mm
§ SOD-123: 3.68 × 1.17 × 1.60 mm
§ SOD-80C: 3.50mm × 1.50mm
§ MELF — Metal Electrode Leadless Face — (mostly resistors and diodes): Barrel shaped components, dimensions do not match those of rectangular references for identical codes.
§ MicroMelf (MMU) Size 0102: L:2.2mm D:1.1mm (solder pad fits rectangular 0805)
§ MiniMelf (MMA) Size 0204: L:3.6mm D:1.4mm (solder pad fits rectangular 1206)
§ Melf (MMB) Size 0207: L:5.8mm D:2.2mm
§ Three-terminal packages
§ SOT: small-outline transistor, with three terminals
§ SOT-23: 3 mm × 1.75 mm × 1.3 mm body - three terminals for a transistor, or up to eight terminals for an integrated circuit
§ SOT-223: 6.7 mm × 3.7 mm × 1.8 mm body - four terminals, one of which is a large heat-transfer pad
§ DPAK (TO-252): discrete packaging. Developed by Motorola to house higher powered devices. Comes in three- or five-terminal versions
§ D2PAK (TO-263) - bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions
§ D3PAK (TO-268) - even larger than D2PAK
§ Packages with four or more terminals
§ Dual-in-line
§ Small-outline integrated circuit (SOIC) - small-outline integrated circuit, dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm
§ J-Leaded Small Outline Package (SOJ) - the same as SOIC except J-leaded
§ TSOP - thin small-outline package, thinner than SOIC with smaller pin spacing of 0.5 mm
§ SSOP - Shrink Small-Outline Package, pin spacing of 0.635 mm or in some cases 0.8mm
§ TSSOP - Thin Shrink Small-Outline package.
§ QSOP - Quarter-Size Small-Outline package, with pin spacing of 0.635 mm
§ VSOP - Very Small Outline Package, even smaller than QSOP; 0.4, 0.5 mm or 0.65 mm pin spacing
§ Quad-in-line
§ PLCC - plastic leaded chip carrier, square, J-lead, pin spacing 1.27 mm
§ QFP - Quad Flat Package, various sizes, with pins on all four sides
§ LQFP - Low-profile Quad Flat Package, 1.4 mm high, varying sized and pins on all four sides
§ PQFP - plastic quad flat-pack, a square with pins on all four sides, 44 or more pins
§ CQFP - ceramic quad flat-pack, similar to PQFP
§ MQFP - Metric Quad Flat Pack, a QFP package with metric pin distribution
§ TQFP - thin quad flat pack, a thinner version of PQFP
§ QFN - quad flat pack, no-leads, smaller footprint than leaded equivalent
§ LCC - Leadless Chip Carrier, contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
§ MLP - Leadframe package with a 0.5 mm contact pitch, no leads [10]
§ PQFN - power quad flat-pack, no-leads, with exposed die-pad[s] for heatsinking
§ Grid arrays
§ PGA - Pin grid array.
§ BGA - ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm
§ LGA - Same Manufacture process of BGA, has Advantage being cooler than BGA by quick Heat Deception feature. No Balls only Patch.
§ FBGA - fine pitch ball grid array, with a square or rectangular array of solder balls on one surface
§ LFBGA - low profile fine pitch ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
§ TFBGA - thin fine pitch ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
§ CGA - column grid array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
§ CCGA - ceramic column grid array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
§ μBGA - micro-BGA, with ball spacing less than 1 mm
§ LLP - Lead Less Package, a package with metric pin distribution (0.5 mm pitch).
§ Non-packaged devices (although surface mount, these devices require specific process for assembly):
§ COB - chip-on-board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package (usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
§ COF - chip-on-flex; a variation of COB, where a chip is mounted directly to a flex circuit.
§ COG - chip-on-glass; a variation of COB, where a chip is mounted directly to a piece of glass - typically an LCD.
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